CUI/High Heat/Insulation | #17530

Hempaprime CUI 275

Description

Hempaprime CUI 275 is a phenolic epoxy improvement based on fast drying, alkylamine cured epoxy. It provides long lasting barrier protection in coating systems for severe corrosive environments, including high temperature and wet conditions found beneath thermal insulation. Available in versions with or without glass flake.

Recommended use

Hempaprime CUI 275 can be used across a wide temperature range where corrosion under insulation (CUI) typically occurs and where thermal cycling is present. It can be specified for operating temperatures from -196°C (-321°F) to 204°C (400°F), with sporadic allowance up to 275°C (527°F). The product significantly reduces the risk of cracking when applied at high DFTs compared to traditional epoxy phenolic coatings. It can be used in new construction and maintenance and repair, on carbon and stainless steels, and for both insulated and uninsulated service.

CUI is one of the most persistent threats in process industries — often invisible until failure. Hempaprime CUI 275 is engineered to reduce that risk with a robust epoxy film that protects even in wet and cyclic thermal environments. Fast-drying, high-build, and versatile in application, it’s designed for both shop and field use where reliability and productivity matter.

Two workers in safety gear review a wooden scale for measuring while standing in an industrial facility with blue pipe structures.

Touch dry in just 1 hour at 20°C. Optimized for high DFT in a single coat, Hempaprime CUI 275 helps reduce application time and accelerate return to service.

Designed for durability in wet, insulated conditions with resistance across a wide thermal range — from cryogenic exposure to high-heat cycling.

A worker in a full protective suit and mask applies industrial coating with a spray gun in a large facility.

Suitable for airless spray, brush, or roller, it’s easy to integrate into both maintenance and newbuild projects, including spot repairs and prefabrication.