CUI is one of the most persistent threats in process industries — often invisible until failure. Hempaprime CUI 275 is engineered to reduce that risk with a robust epoxy film that protects even in wet and cyclic thermal environments. Fast-drying, high-build, and versatile in application, it’s designed for both shop and field use where reliability and productivity matter.

Touch dry in just 1 hour at 20°C. Optimized for high DFT in a single coat, Hempaprime CUI 275 helps reduce application time and accelerate return to service.

Designed for durability in wet, insulated conditions with resistance across a wide thermal range — from cryogenic exposure to high-heat cycling.

Suitable for airless spray, brush, or roller, it’s easy to integrate into both maintenance and newbuild projects, including spot repairs and prefabrication.